New Report Available: Global Die-level Packaging Equipment Market 2015-2019

Fast Market Research announces the availability of Technavio's new report "Global Die-Level Packaging Equipment Market 2015-2019" on their comprehensive research portal.

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials. Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.

Get More Details on this Report and a Full Table of Contents at Global Die-level Packaging Equipment Market 2015-2019

Commenting on the report, an analyst from Technavio’s team said: "The short replacement cycle of portable electronic devices is a key trend observed in this market. Frequent launches of next-version models render the current portable devices obsolete within a short period of time. This short lifespan will augment the demand for semiconductor wafers during the forecast period."

According to the report, steady growth of semiconductor wafer industry is a major driver that promotes growth in this market. The demand for semiconductor wafers is continually increasing owing to the augmented demand for portable electronic devices globally. Steady growth of semiconductor wafer industry

Further, the report states that the increasing dependency on few key suppliers is a major challenge faced by this market. Inability of the raw material suppliers to provide resources on time negatively affects the business of semiconductor die-level packaging equipment manufacturers.

The key players in the Global Die-Level Packaging Equipment Market are ASM International NV, BE Semiconductor Industries N.V. (Besi), DISCO Corp., and Kulicke & Soffa Industries Inc. while other prominent vendors include Cohu, TOWA, Shinkawa, Advantest, and Hitachi High-Technologies.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

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