IC Packaging Market in Taiwan 2015-2019 - New Market Research Report

From: Fast Market Research, Inc.
Published: Tue Sep 01 2015

Fast Market Research announces the availability of Technavio's new report "IC Packaging Market in Taiwan 2015-2019" on their comprehensive research portal.

ICs manufactured in the global semiconductor industry are delicate and vulnerable to contamination. To eliminate such eventualities, silicon chips or ICs are protected using packaging materials. Wafer-level packaging is one such packaging that involves the packaging of individual ICs using best-fit packaging processes during the semiconductor production process.

Technavio's analysts forecast the IC packaging market in Taiwan to grow at a CAGR of 2.5% over the period 2014-2019.

Get More Details on this Report and a Full Table of Contents at IC Packaging Market in Taiwan 2015-2019

The report analyst commented, "Portable electronic devices such as smartphones and tablets become obsolete after a short time. This is because of rapid launches of next-version models by vendors. The duration of the replacement-cycle period, on average, is 8-12 months. In the past, the replacement period was much longer. Because of the reduction in product-replacement-cycle time, the demand for semiconductor ICs in newly launched devices is expected to rise drastically, and this will increase the demand for IC packaging, leading to the growth of the market."

According to the report, the availability of low-cost smartphones in Taiwan and increased access to the internet are expected to increase the shipments of smartphones and tablets during the forecast period. With the increasing functionality of smartphones and tablets coupled with the growing LTE infrastructure, consumers are demanding these devices at a higher rate. Semiconductor ICs, an integral part of such devices, will undergo a similar rise in demand, leading to market growth during the forecast period.

Further, the report states that the market requires high capital investment, which is a major challenge for its growth.

The key players in the IC Packaging Market in Taiwan are Advanced Semiconductor Engineering, Powertech Technology and Siliconware Precision Industries while other prominent vendors include Amkor Technology, ChipMOS Technologies, Greatek Electronics, King Yuan ELECTRONICS, Orient Semiconductor Electronics, STATS ChipPAC and UTAC

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

About Fast Market Research

Fast Market Research is a leading distributor of market research and business information. Representing the world's top research publishers and analysts, we provide quick and easy access to the best competitive intelligence available. Our unbiased, expert staff is always available to help you find the right research to fit your requirements and your budget.

For more information about these or related research reports, please visit our website at http://www.fastmr.com or call us at 1.800.844.8156 (1.413.485.7001 Int'l)

You may also be interested in these related reports:

- Semiconductor & IC Packaging Materials Market - Regional Trends & Forecast to 2019
- Taiwanese IC Packaging & Testing Industry, 2Q 2014
- Taiwanese IC Packaging & Testing Industry, 4Q 2014
- Global Semiconductor Packaging Materials Market 2015-2019
- Paper Packaging & Paperboard Packaging Market - Trends & Forecast to 2020

Company: Fast Market Research, Inc.
Contact Name: Bill Thompson
Contact Email: press@fastmr.com
Contact Phone: 1-413-485-7001

Visit website »