The substrates of plastic area array packages are organic and are developed using standard PCB technology. Numerous advantages are being offered by organic substrates which, in turn, is increasing its use in various applications. For example, the technology used in organic substrate is similar to the technology used in manufacturing PCB, hence it reduces the cost of the production as compared to production cost of ceramic substrates. However, higher thermal resistance than ceramic substrates is one of the biggest challenges for organic substrates.
Request for a Free Sample of this report @ https://www.factmr.com/connectus/sample?flag=S&rep_id=360
As per a study by Fact.MR, the global market for organic substrate is anticipated to witness steady growth from 2017 to 2026. The global organic substrate market is also expected to reach US$ 13,438.1 million value towards 2026 end. Increasing demand for ultra-thin mobile phones is resulting in the increased use of flip-chip technology connecting die to the substrate. Moreover, increasing trend towards lightweight, smaller and cost-effective devices is leading towards increasing use of organic substrate. Major technology companies are also moving towards using organic substrate instead of ceramic substrate due to the low cost. Also, OLED made of single layer of organic material is moving towards using multiple layers to increase effectiveness and efficiency.
Tape Substrate to Emerge as the Largest Substrate Type
Compared to the rigid substrate, tape substrate is likely to gain the highest revenue share between 2017 and 2026. Tape substrate is projected to account for more than half of the revenue share by 2017 end and also likely to surpass US$ 9,100 million revenue. Due to their flexibility tape substrates are being used in various consumer electronics.
Get Access To TOC Covering 200+ Topics @ https://www.factmr.com/report/360/organic-substrate-market
Small Outline Packages (SOP) to Emerge as the Highly Preferred Technology
Small outline packages is likely to emerge as one of the highly preferred technologies in the global market for organic substrate. By 2026 end, small outline packages (SOP) are projected to surpass US$ 4,400 million revenue. There has been an increasing demand for fine integrated circuit packages as these small outline packages minimize total volume consumed by memory components. Most of the small outline packages have pin spacing less than 1.27 mm.
Organic Substrates to Find Largest Application in Mobile Phones
Organic substrates are likely to find the largest application in mobile phones during the forecast period from 2017 to 2026. Mobile phones are projected to create an incremental opportunity of over US$ 1,900 million between 2017 and 2026. Increasing demand for wireless components and mobile phones is transforming the way electronic devices are designed. Increasing development of ultra-thin smartphones is resulting in the growing use of organic substrate. Moreover, organic substrates are also being used for RF modules and more functionality is being integrated RF modules for smartphones.
The report also profiles companies that are expected to remain active in the expansion of global organic substrate market through 2026, which include Kyocera, Shinko, Mistubishi Electric, Qualcomm Technologies, STMicroelectronics, Amkor Technology, Henkel AG, Sumitomo Chemical Co. Ltd., BASF, Dow Chemicals, Samsung Electronics, and Hitachi Chemical.
Ask Industry Expert about this Report @ https://www.factmr.com/connectus/sample?flag=AE&rep_id=360
Organic Substrate Market Projected to Augment at a Notable CAGR during the Forecast Period until 202
Contact Name: Pankaj
Contact Email: firstname.lastname@example.org
Contact Email: email@example.com